Layered probe "High current, multi-point layered probe (patented technology)"
As an inspection of the front-end process of power semiconductors, applying uniformly at multiple points on the wafer surface reduces the burden on the semiconductor.
This is a probe developed with innovative technology, featuring excellent characteristics. We have developed a multi-point laminated probe specifically for power semiconductors, applying the characteristics of a laminated structure consisting of metal plates (probes) and insulators. 【Features】 - The probe tip is shaped like a wave, allowing contact with the semiconductor at multiple points. This disperses the amount of current and voltage applied, reducing the burden on the semiconductor. - It can move vertically by about 1 millimeter, minimizing contact marks. - Its compact design makes it easy to secure installation space. *For more details, please download the PDF or contact us.
- Company:インクス
- Price:Other